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TLP291 2012-04-26 1 toshiba photocoupler gaas i red & photo-transistor TLP291 power supplies programmable controllers hybrid ics TLP291 consists of photo transistor, opt ically coupled to a gallium arsenide infrared emitting diode. TLP291 is h oused in the so4 package, very small and thin coupler. since TLP291 is guaranteed wide oper ating temperature (ta=-55 to 110 ?c) and high isolation voltage (3750vrms), it?s suitable for high-density surface mounting applications such as sm all switching power supplies and programmable controllers. z collector-emitter voltage : 80 v (min) z current transfer ratio : 50% (min) rank gb : 100% (min) z isolation voltage : 3750 vrms (min) z operation temperature: -55 to 110 ?c z ul recognized : ul1577, file no. e67349 z cul approved : csa component acceptance service no.5a, file no. 67349 z semko aprroved: en 60065: 2002, approved no. 1200315 en 60950-1: 2001, en 60335-1: 2002, approved no. 1200315 z bsi approved : bs en 60065: 2002, approved no. 9036 : bs en 60950-1: 2006, approved no. 9037 z option (v4) vde approved: en 60747-5-5 certificate, no. 40009347 maximum operating insulation voltage: 707 vpk highest permissible over-voltage: 6000 vpk (note) when a en 60747-5-5 approved type is needed, please designate the ?option(v4)? construction mechanical rating creepage distance:5.0mm(min) clearance:5.0mm(min) insultion thickn ess:0.4mm(min) toshiba 11-3c1 weight: 0.05 g (typ.) 1:anode 2:cathode 3:emitter 4:collector 1 2 4 3 TLP291 pin configuration unit: mm free datasheet http://www..net/
TLP291 2012-04-26 2 current transfer ratio (ctr) rank ( un less otherwise specified, ta = 25c) note1: specify both the part number and a rank in this format when ordering (e.g.) rank gb: TLP291 (gb,e for safety standard certification, howe ver, specify the part number alone. (e.g.)TLP291 (gb,e: TLP291 current transfer ratio (%) (i c / i f ) i f = 5 ma, v ce = 5 v, ta = 25c type classification (note1) min max marking of classification blank 50 400 blank, ye, y+, gr, gb, g, g+,b rank y 50 150 ye rank gr 100 300 gr rank gb 100 400 gb rank yh 75 150 y+ rank grl 100 200 g rank grh 150 300 g+ TLP291 rank bll 200 400 b free datasheet http://www..net/
TLP291 2012-04-26 3 absolute maximum ratings (note)( unless otherwise specified, ta = 25c) characteristic symbol note rating unit input forward current i f 50 ma input forward current derating (ta 90c) ? i f / ta -1.5 ma /c input forward current (pulsed ) i fp (note 2) 1 a input reverse voltage v r 5 v input power dissipation p d 100 mw input power dissipation derating (ta 90c) p d / ta -3.0 mw/c led junction temperature t j 125 c collector-emitter voltage v ceo 80 v emitter-collector voltage v eco 7 v collector current i c 50 ma collector power dissipation p c 150 mw collector power dissipation derating(ta 25c) ? p c / ta -1.5 mw /c detector junction temperature t j 125 c operating temperature range t opr -55 to 110 c storage temperature range t stg -55 to 125 c lead soldering temperature t sol 260 (10s) c total package power dissipation p t 200 mw total package power dissipation derating(ta 25c) ? p t / ta -2.0 mw /c isolation voltage bv s (note3) 3750 vrms note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note2: pulse width 100 s, frequency 100hz note3: ac, 1 minute, r.h. 60%, device considered a two terminal device: led side pins shorted together and detector side pins shorted together. electrical characteristics (unless otherwise specified, ta = 25c) characteristic symbol test condition min typ. max unit input forward voltage v f i f = 10 ma 1.1 1.25 1.4 v input reverse current i r v r = 5 v - - 5 a led input capacitance c t v = 0 v, f = 1 mhz - 30 - pf collector-emitter breakdown voltage v (br) ceo i c = 0.5 ma 80 - - v emitter-collector breakdown voltage v (br) eco i e = 0.1 ma 7 - - v v ce = 48 v - 0.01 0.08 a dark current i ceo v ce = 48 v, ta = 85c - 2 50 a detector collector-emitter capacitance c ce v = 0 v, f = 1 mhz - 10 - pf free datasheet http://www..net/
TLP291 2012-04-26 4 coupled electrical characteristics (unless otherwise specified, ta = 25c) characteristic symbol test condition min typ. max unit 50 - 400 current transfer ratio i c / i f i f = 5 ma, v ce = 5 v rank gb 100 - 400 % - 60 - saturated current transfer ratio i c / i f (sat) i f = 1 ma, v ce = 0.4 v rank gb 30 - - % i c = 2.4 ma, i f = 8 ma - - 0.3 - 0.2 - collector-emitter saturation voltage v ce (sat) i c = 0.2 ma, i f = 1 ma rank gb - - 0.3 v off-state collector current i c (off) v f = 0.7 v, v ce = 48 v - - 10 a isolation characteristics (unless otherwise specified, ta = 25c) characteristic symbol test condition min typ. max unit total capacitance (input to output) c s v s = 0 v, f = 1 mhz - 0.8 - pf isolation resistance r s v s = 500 v, r.h. 60% 110 12 10 14 - ? ac , 1 minute 3750 - - ac , 1 second, in oil - 10000 - vrms isolation voltage bv s dc , 1 minute, in oil - 10000 - vdc switching characteristics (unless otherwise specified, ta = 25c) characteristic symbol test condition min typ. max unit rise time t r - 4 - fall time t f - 7 - turn-on time t on - 7 - turn-off time t off v cc = 10 v, i c = 2 ma r l = 100 ? - 7 - s turn-on time t on - 2 - storage time t s - 30 - turn-off time t off r l = 1.9 k ? (fig.1) v cc = 5 v, i f = 16 ma - 60 - s (fig.1) switching time test circuit t on t off free datasheet http://www..net/
TLP291 2012-04-26 5 i f -ta p c -ta input forward current i f (ma) 0 20 40 60 80 100 -20 0 20 40 60 80 100 120 collector power dissipation p c (mw) 0 20 40 60 80 100 120 140 160 -20 0 20 40 60 80 100 120 ambient temperature ta ( ? c) ambient temperature ta ( ? c) i fp -d r i f -v f input forward current (pulsed) i fp (ma) input forward current i f (ma) 0.1 1 10 100 0.6 0.8 1 1.2 1.4 1.6 1.8 2 duty cycle ratio d r input forward voltage v f (v) v f / ta - i f i fp - v fp input forward current derating v f / ta (mv/c) -3.2 -2.8 -2.4 -2 -1.6 -1.2 -0.8 -0.4 0.1 1 10 100 input forward current (pulsed) i fp (ma) 1 10 100 1000 0.6 1 1.4 1.8 2.2 2.6 3 3.4 input forward current i f (ma) input forward voltage (pulsed) v fp (v) note: the above characteristics curves are presented fo r reference only and not guaranteed by production test, unless otherwise noted. 110 ?c 85?c 50?c 25?c 0 ?c -25?c -55?c pules width ? 100 s ta =25 ? c 10 30 50 100 1000 300 500 3000 10 -3 10 -2 10 -1 10 0 pulse width ? 10 s repeative frequency=100hz ta =25 c (note) this curve shows the maximum limit to the input forward current. (note) this curve shows the maximum limit to the collector power dissipation. (note) this curve shows the maximum limit to the input forward current (pulsed). free datasheet http://www..net/
TLP291 2012-04-26 6 i c -v ce i c -v ce collector current i c (ma) collector current i c (ma) 0 5 10 15 20 25 30 0 0.2 0.4 0.6 0.8 1 collector-emitter voltage v ce (v) collector-emitter voltage v ce (v) i c -i f i ceo -ta collector current i c (ma) 0.1 1 10 100 0.1 1 10 100 dark current i ceo ( a) 0.0001 0.001 0.01 0.1 1 10 0 20 40 60 80 100 120 input forward voltage i f (ma) ambient temperature ta (c) i c/ i f -i f current transfer ratio i c / i f (%) 10 100 1000 0.1 1 10 100 input forward current i f (ma) note: the above characteristics curves are presented fo r reference only and not guaranteed by production test, unless otherwise noted. 0 10 20 30 40 50 0246810 5 10 50 30 20 15 ta =25 ? c v ce =10v v ce =5v v ce =0.4v v ce =10v v ce =5v v ce =0.4v 24v 10v 5v v ce =48v i f =2ma i f =5ma 10 15 20 30 50 p c (max) ta =25 ? c ta =25 ? c free datasheet http://www..net/
TLP291 2012-04-26 7 v ce(sat) - ta i c - ta collector-emitter saturation voltage v ce(sat) (v) 0.00 0.04 0.08 0.12 0.16 0.20 0.24 0.28 -60 -40 -20 0 20 40 60 80 100 120 collector current i c (ma) 0.1 1 10 100 -60 -40 -20 0 20 40 60 80 100 120 ambient temperature ta (c) ambient temperature ta (c) switching time - r l switching time - ta switching time ( s) 1 10 100 1000 10000 110100 switching time ( s) 0.1 1 10 100 1000 -60 -40 -20 0 20 40 60 80 100 120 load resistance r l (k ? ) ambient temperature ta (c) note: the above characteristics curves are presented fo r reference only and not guaranteed by production test, unless otherwise noted. i f =8ma, i c =2.4ma i f =1ma, i c =0.2ma v ce =5v i f =0.5m a 5 1 10 25 t off ta =25 ? c i f =16ma v cc =5v i f =16ma v cc =5v r l =1.9k ? t s t on t off t s t on free datasheet http://www..net/
TLP291 2012-04-26 8 soldering and storage 1. soldering 1.1 soldering when using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) using solder reflow temperature profile example of lead (pb) solder temperature profile example of using lead (pb)-free solder reflow soldering must be performed once or twice. the mounting should be completed with the interval fr om the first to the last mountings being 2 weeks. 2) using solder flow (for lead (pb) solder, or lead (pb)-free solder) please preheat it at 150c between 60 and 120 seconds. complete soldering within 10 seconds below 260c. each pin may be heated at most once. 3) using a soldering iron complete soldering within 10 seconds below 260c, or within 3 seconds at 350c. each pin may be heated at most once. time (s) (c) 240 210 160 60 to 120s less than 30s package surface temperature 140 time (s) (c) 260 230 190 60 to 120s 30 to 50s 180 package surface temperature this profile is based on the device?s maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. this profile is based on the device?s maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. free datasheet http://www..net/
TLP291 2012-04-26 9 2. storage 1) avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) follow the precautions printed on the packing label of the device for transportation and storage. 3) keep the storage location temperature and humidity within a range of 5c to 35c and 45% to 75%, respectively. 4) do not store the products in locations with poiso nous gases (especially corrosive gases) or in dusty conditions. 5) store the products in locations with minimal temperature fluctuations. rapi d temperature changes during storage can cause condensation, resu lting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) when restoring devices after removal from their packing, use an ti-static containers. 7) do not allow loads to be applied direct ly to devices while they are in storage. 8) if devices have been stored for more than two year s under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. free datasheet http://www..net/
TLP291 2012-04-26 10 en 60747-5-5 option:(v4) types : TLP291 type designations for ?option: (v4) ?, which are tested under en 60747 requirements. (e.g.): TLP291 (v4gb-tp,e v4 : en 60747 option gb : ctr rank type tp : standard tape & reel type e : [[g]]/rohs compatible (note4 ) note: use toshiba standard type number for safety standard application. (e.g.): TLP291(v4gb-tp,e ? TLP291 note4: please contact your toshiba sa les representative for details on environmental information such as the product?s rohs compatibility. rohs is the directive 2002/95/ec of the european parliament and of the council of 27 january 2003 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. en 60747 isolation characteristics description symbol rating unit application classification for rated mains voltage 150vrms for rated mains voltage 300vrms i-iv i-iii - climatic classification 55 / 110 / 21 - pollution degree 2 - maximum operating insulation voltage v iorm 707 vpk input to output test voltage, method a vpr=1.5 v iorm , type and sample test tp=10s, partial discharge<5pc v pr 1060 vpk input to output test voltage, method b vpr=1.875 v iorm , 100% production test tp=1s, partial discharge<5pc v pr 1325 vpk highest permissible overvoltage (transient overvoltage, tpr=60s) v tr 6000 vpk safety limiting values (max. permissible rating s in case of fault, also refer to thermal derating curve) current (input current: i f , psi=0mw) power (output or total power dissipation) temperature i si p si t si 250 400 150 ma mw c insulation resistance v io =500v, ta=t si r si > = 10 9 free datasheet http://www..net/
TLP291 2012-04-26 11 insulation related specifications minimum creepage distance cr 5.0mm minimum clearance cl 5.0mm minimum insulation thickness ti 0.4mm comparative tracking index ctl 175 1. if a printed circuit is incorporated, the creepage di stance and clearance may be reduced below this value. (e.g. at a standard distance betwe en soldering eye centers of 3.5mm). if this is not permissible, the user shall take suitable measures. 2. this photocoupler is suitable for ?safe electric al isolation? only within the safety limit data. maintenance of the safety data shall be ensured by means of protective circuit. vde test sign: marking on product for en 60747 : marking on packing for en 60747 marking example: TLP291 v v d e 1pin mark ctr rank mark lot no. type v country of origin e.g.) j; japan option(v4) mark process lot no. free datasheet http://www..net/
TLP291 2012-04-26 12 figure 1 partial discharge measurement procedure according to en 60747 destructive test for qualification and sampling tests. method a (for type and sampling tests, destructive tests) t 1 , t 2 t 3 , t 4 t p (measuring time for partial discharge) t b t ini v v initial (6kv) v pr (1060v) v iorm (707v) 0 t 1 t ini t 3 t 2 t p t b t 4 t = 1 to 10 s = 1 s = 10 s = 12 s = 60 s t p v pr (1325v ) v iorm (707v ) v t t 3 t 4 t b figure 2 partial discharge measurement procedure according to en 60747 non-destructive test for100% inspection. method b (for sample test, non- destructive test) t 3 , t 4 t p (measuring time for partial discharge) t b = 0.1 s = 1 s = 1.2 s figure 3 dependency of maximum safety ratings on ambient temperature 500 400 300 200 100 0 0 25 50 75 100 125 150 175 500 400 300 200 100 0 ta (c) ? psi isi ? isi (ma) psi ( mw ) free datasheet http://www..net/
TLP291 2012-04-26 13 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted fo r use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nse quential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the applicable export laws and regulations including, without limitat ion, the japanese foreign exchange and foreign trade law and t he u.s. export administration regulations. export and re-export of pr oduct or related software or technology are strictly prohibit ed except in compliance with all appl icable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. free datasheet http://www..net/

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